Power Supply: VDD = 1.2V Typical VDDQ = 1.2V Typical VPP = 2.5V Typical VDDSPD = 2.2V to 3.6V Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals Low-power auto self refresh (LPASR) Data bus inversion (DBI) for data bus On-die VREFDQ generation and calibration Single-rank On-board I2 serial presence-detect (SPD) EEPROM 8 internal banks; 2 groups of 4 banks each Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS) Selectable BC4 or BL8 on-the-fly (OTF) Fly-by topology Terminated control command and address bus PCB: Height 1.18” (30.00mm) RoHS Compliant and Halogen-Free .

Brand Kingston
Model KX830D-ELC
Type 204-Pin DDR3 SO-DIMM
Capacity 4GB
Speed DDR3 1333MHz (PC3 10600)
Cas Latency 9
Voltage 1.5V
ECC N

18.00 $

  • One 4GB Module of 1333MHZ DDR3 Memory
  • Specifically designed and tested for compatibility in various devices
  • 204-Pin Non-ECC Unbuffered SODIMM
  • From the industry leader in PC Memory
  • Backed by a lifetime warranty and free technical support. Customer’s system requires 2Gbit (Gigabit) density D-RAM chip modules.

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Be the first to review “Power Supply: VDD = 1.2V Typical VDDQ = 1.2V Typical VPP = 2.5V Typical VDDSPD = 2.2V to 3.6V Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals Low-power auto self refresh (LPASR) Data bus inversion (DBI) for data bus On-die VREFDQ generation and calibration Single-rank On-board I2 serial presence-detect (SPD) EEPROM 8 internal banks; 2 groups of 4 banks each Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS) Selectable BC4 or BL8 on-the-fly (OTF) Fly-by topology Terminated control command and address bus PCB: Height 1.18” (30.00mm) RoHS Compliant and Halogen-Free .”

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